Bonding to an Array of Chip Technologies and Interfaces

Interconnecting Chip Technologies to Standard or Custom Interfaces

Connecting semiconductors and people through the same wire is what we do.

Our work goes well beyond the bonder, connecting a circuit to an interface using very fine wire.

We connect technologies for different processes or applications in communication, distance learning, medical, internet of things, cellular systems, and handsets for first responders.

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Wire bonding is the process of creating electrical interconnections between semiconductors (or other integrated circuits) using bonding wires, which are fine wires made of gold or aluminum and silicon.

At Semi-Conn NE we use Hesse-Mechatronics BJ815 automatic bonders and can bond to an array of chip technologies and interfaces.

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